Shuchang Luo

Influence of temperature and humidity on adhesion of underfills for flip chip packaging

Shuchang Luo, C.P. Wong · IEEE Transactions on Components and Packaging Technologies · 2005 · 83 citations

Engineering, Mechanical Engineering, Glass Material +17

Coligand modifications fine-tuned the structure and magnetic properties of two triple-bridged azido-Cu(<scp>ii</scp>) chain compounds exhibiting ferromagnetic ordering and slow relaxation

Xiangyu Liu, Feifei Li, Xiaohui Ma et al. · Dalton Transactions · 2016 · 64 citations

Modulation of the magnetic anisotropy of octahedral cobalt(<scp>ii</scp>) single-ion magnets by fine-tuning the axial coordination microenvironment

Yuewei Wu, Danian Tian, Jesús Ferrando‐Soria et al. · Inorganic Chemistry Frontiers · 2019 · 61 citations

Magnetic Properties, Octahedral Co, Single-ion Magnets +24

Study on effect of carbon black on behavior of conductive polymer composites with positive temperature coefficient

Shuchang Luo, C.P. Wong · IEEE Transactions on Components and Packaging Technologies · 2000 · 44 citations · Full text

Engineering, Mechanical Engineering, Polymer Nanocomposites +18

Copper/hexagonal Boron Nitride Nanosheet Composite as an Electrochemical Sensor for Nitrite Determination

Yu Zhang, Zhi Xia, Qianzhu Li et al. · International Journal of Electrochemical Science · 2018 · 27 citations · Full text