Characteristic study of anisotropic-conductive film for chip-on-film packaging

Adhesive flip chip bonding on flexible substrates

R. Aschenbrenner, R. Miessner, H. Reichl · 1997 · 38 citations

Engineering, Materials Engineering, Materials Science +14

Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications

Y.C. Chan, K.C. Hung, Chengcheng Tang et al. · 2002 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +15

Flip-chip on flex for 3D packaging

P. Clot, J.-F. Zeberli, J.-M. Chenuz et al. · 2003 · 22 citations

Engineering, Materials Engineering, Digital Fabrication +11

Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste

Francesc Ferrando, J.-F. Zeberli, P. Clot et al. · 2002 · 17 citations

Engineering, Materials Engineering, Materials Science +17

Anisotropic conductive adhesive films for flip chip on flex packages

Li Li, Treliant Fang · 2002 · 12 citations

Engineering, Materials Engineering, Materials Science +17