Innovative polyimide liner deposition method for high-aspect-ratio and high-density through-silicon-vias (TSVs)

Low dielectric constant polymers for microelectronics

G. Maier · Progress in Polymer Science · 2001 · 1.1K citations

Natural Sciences, Materials Engineering, Materials Science +12

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 487 citations

Engineering, Electrical Engineering, Circuit Theory +16

Polyimides

C. E. Sroog · Journal of Polymer Science Macromolecular Reviews · 1976 · 454 citations

3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

Jian‐Qiang Lu · Proceedings of the IEEE · 2009 · 313 citations

Engineering, Manufacturing Engineering, Materials Science +17

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-Kyu Ryu, Kuan-Hsun Lu, Xuefeng Zhang et al. · IEEE Transactions on Device and Materials Reliability · 2010 · 257 citations

Engineering, Electrical Engineering, Materials Science +17