Miao Xiong

Electrical Characterization of Coaxial Silicon–Insulator–Silicon Through-Silicon Vias: Theoretical Analysis and Experiments

Zhiming Chen, Miao Xiong, Bohao Li et al. · IEEE Transactions on Electron Devices · 2016 · 24 citations

Engineering, Electrical Engineering, Microelectronics +16

Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter

Miao Xiong, Zhiming Chen, Yingtao Ding et al. · IEEE Electron Device Letters · 2018 · 19 citations

Engineering, Electrical Engineering, Materials Science +16

Innovative polyimide liner deposition method for high-aspect-ratio and high-density through-silicon-vias (TSVs)

Yingtao Ding, Miao Xiong, Yangyang Yan et al. · Microelectronic Engineering · 2015 · 16 citations

Engineering, Materials Engineering, Materials Science +14

Wideband Capacitance Evaluation of Silicon–Insulator–Silicon Through-Silicon-Vias for 3D Integration Applications

Xinghua Wang, Miao Xiong, Zhiming Chen et al. · IEEE Electron Device Letters · 2015 · 16 citations

Engineering, Electrical Engineering, Materials Science +17

Low capacitance and highly reliable blind through-silicon-vias (TSVs) with vacuum-assisted spin coating of polyimide dielectric liners

YangYang Yan, Miao Xiong, Bin Liu et al. · Science China Technological Sciences · 2016 · 13 citations

Engineering, Electrical Engineering, Materials Science +16