Concepedia

Wafer Dicing

Wafer Dicing is a semiconductor fabrication process that involves singulating individual integrated circuit dies from a processed silicon wafer through precise material removal techniques such as sawing or laser cutting.

182

Publications

6.1K

Citations

765

Authors

210

Institutions

Publications per year

2017–2026

37

Variants

Die SingulationWafer Singulation

Parents

Publications

182

Selective niobium anodization process for fabricating Josephson tunnel junctions

H. Kröger, L. N. Smith, D. W. Jillie · Applied Physics Letters · 1981 · 314 citations

, , +14

Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators

Rob N. Candler, Matthew A. Hopcroft, Bongsang Kim et al. · Journal of Microelectromechanical Systems · 2006 · 205 citations

, , +17

Wafer fusion: A novel technique for optoelectronic device fabrication and monolithic integration

Z. L. Liau, D.E. Mull · Applied Physics Letters · 1990 · 186 citations

, , +17

Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing

Masayoshi Kumagai, Naoki Uchiyama, Etusji Ohmura et al. · IEEE Transactions on Semiconductor Manufacturing · 2007 · 176 citations

, , +15

An Embedded Device Technology Based on a Molded Reconfigured Wafer

Markus Brunnbauer, E. Furgut, G. Beer et al. · 2006 · 175 citations

, , +17

1–5 of 182

Authors

765

  1. EB
    Eric Beyne

    IMEC, Belgium

    5 publications · 90 citations

    5

    h-index

  2. FI
    Fumihiro Inoue

    IMEC, Belgium

    5 publications · 90 citations

    5

    h-index

  3. NU
    Naoki Uchiyama

    Toyohashi University of Technology, Japan

    4 publications · 232 citations

    4

    h-index

  4. EO
    Etsuji Ohmura

    The University of Osaka, Japan

    4 publications · 118 citations

    4

    h-index

  5. KF
    Kenshi Fukumitsu

    Hamamatsu Photonics (Japan), Japan

    4 publications · 277 citations

    4

    h-index

1–5 of 765

Institutions

210

  1. The University of Osaka

    Osaka, Japan

    6 h-index

    12 publications

    385 citations

  2. IMEC

    Leuven, Belgium

    5 h-index

    36 publications

    649 citations

  3. Hamamatsu Photonics (Japan)

    Hamamatsu, Japan

    5 h-index

    21 publications

    1.2K citations

  4. Toshiba (Japan)

    Tokyo, Japan

    4 h-index

    17 publications

    473 citations

  5. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    4 h-index

    24 publications

    821 citations

  6. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    4 h-index

    38 publications

    1.3K citations

  7. CEA Grenoble

    Grenoble, France

    4 h-index

    37 publications

    1.3K citations

  8. IBM (United States)

    Armonk, United States

    4 h-index

    11 publications

    211 citations

1–8 of 210

Venues

  1. 9

    h-index

  2. 9

    h-index

  3. Microelectronics Reliability

    5 publications · 155 citations

    5

    h-index

  4. Journal of Manufacturing Processes

    JMP · 5 publications · 201 citations

    5

    h-index

  5. Journal of Materials Processing Technology

    4 publications · 190 citations

    4

    h-index

1–5