Thermal Device Simulation

Thermal Device Simulation is a computational modeling approach that specifically characterizes the temperature-dependent behavior and heat transfer dynamics within physical devices, distinguishing itself from other device simulation methods by focusing on thermal effects and their influence on device performance and reliability.

450

Publications

16.6K

Citations

1.6K

Authors

552

Institutions

Publications per year

2017–2026

112

Authors

1.6K

  1. AP
    A. Poppe

    Budapest University of Technology and Economics, Hungary

    9 publications · 309 citations

    9

    h-index

  2. MR
    M. Rencz

    Budapest University of Technology and Economics, Hungary

    7 publications · 332 citations

    7

    h-index

  3. BS
    Bahgat Sammakia

    Binghamton University, United States

    5 publications · 615 citations

    5

    h-index

  4. AB
    Avram Bar‐Cohen

    University of Maryland, College Park, United States

    5 publications · 469 citations

    5

    h-index

  5. VS
    Vladimı́r Székely

    Budapest Institute, Hungary

    5 publications · 264 citations

    5

    h-index

1–5 of 1.6K

Venues

  1. Applied Thermal Engineering

    21 publications · 1.7K citations

    17

    h-index

  2. IEEE Transactions on Electron Devices

    14 publications · 670 citations

    14

    h-index

  3. Microelectronics Reliability

    15 publications · 333 citations

    14

    h-index

  4. International Journal of Heat and Mass Transfer

    14 publications · 819 citations

    14

    h-index

  5. IEEE Electron Device Letters

    10 publications · 408 citations

    10

    h-index

1–5