Concepedia

Ravi Kandasamy

RK

Statistics

Publications

5

Citations

950

H-Index

5

Active since

2005

Affiliations

National University of Singapore(Current)

Ravi Kandasamy is an author at National University of Singapore specializing in thermal engineering, heat transfer, and engineering.

Top concepts

EngineeringHeat TransferThermal EngineeringElectronic PackagingThermodynamicsThermal ModelingMicroelectronicsThermal ManagementElectrical EngineeringRefrigeration

Publications per year

2005–2008

5

Publications

5

Transient cooling of electronics using phase change material (PCM)-based heat sinks

Ravi Kandasamy, Xiangqi Wang, Arun S. Mujumdar · Applied Thermal Engineering · 2007 · 482 citations

Transient Cooling, Electrical Engineering, Phase-change Material +10

Application of phase change materials in thermal management of electronics

Ravi Kandasamy, Xiangqi Wang, Arun S. Mujumdar · Applied Thermal Engineering · 2007 · 385 citations

Materials Science, Materials Engineering, Phase-change Material +10

Interface thermal characteristics of flip chip packages – A numerical study

Ravi Kandasamy, A.S. Mujumdar · Applied Thermal Engineering · 2008 · 31 citations

Flip Chip, Numerical Study, Chip-scale Package +9

Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages

Ravi Kandasamy, Suresh Subramanyam · International Journal of Numerical Methods for Heat &amp Fluid Flow · 2005 · 29 citations

Engineering, Mechanical Engineering, Cfd Technique +25

Thermal analysis of a flip chip ceramic ball grid array (CBGA) package

Ravi Kandasamy, A.S. Mujumdar · Microelectronics Reliability · 2007 · 23 citations

Electrical Engineering, Chip-scale Package, Engineering +7

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