Package Characterization is the systematic evaluation of a MEMS package's physical, mechanical, thermal, and electrical properties to verify performance, reliability, and environmental robustness within its operational context.
100
Publications
3K
Citations
323
Authors
105
Institutions
Publications per year
2017–2026
6
Parents
Publications
100
1–5 of 100
Authors
323
- YL
6
h-index
- CY
4
h-index
- GF
3
h-index
- BCB. Courtois
Techniques of Informatics and Microelectronics for Integrated Systems Architecture, France
3 publications · 85 citations
3
h-index
- AP
3
h-index
1–5 of 323
Institutions
105
Motorola (United States)
Schaumburg, United States
8 h-index
20 publications
390 citations
Advanced Semiconductor Engineering (Taiwan)
Kaohsiung, Taiwan
8 h-index
25 publications
1.2K citations
IBM (United States)
Armonk, United States
4 h-index
9 publications
265 citations
Intel (United States)
Santa Clara, United States
4 h-index
6 publications
154 citations
Texas Instruments (United States)
Dallas, United States
4 h-index
12 publications
264 citations
Budapest University of Technology and Economics
Budapest, Hungary
3 h-index
9 publications
166 citations
Rambus (United Kingdom)
East Kilbride, United Kingdom
2 h-index
9 publications
108 citations
Flex (United States)
San Jose, United States
2 h-index
2 publications
31 citations
1–8 of 105
Venues
- Microelectronics Reliability
13 publications · 546 citations
12
h-index
- IEEE Transactions on Components and Packaging Technologies
5 publications · 118 citations
5
h-index
- IEEE Transactions on Components Hybrids and Manufacturing Technology
3 publications · 174 citations
3
h-index
- Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
2 publications · 24 citations
2
h-index
- Journal of Electronic Materials
JEM · 2 publications · 44 citations
2
h-index
1–5