Embedded Die Packaging

Embedded Die Packaging is a chip packaging technology in which a semiconductor die is embedded within a substrate or encapsulation material to enable high-density interconnectivity, improved thermal dissipation, and reduced package footprint compared to conventional surface-mounted die configurations.

Publications

4.3K

Citations

431

Authors

Institutions

Publications per year

2017–2026

Parents

Chip Packaging

Publications

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 357 citations

Engineering, Computer Engineering, Electrical Engineering +17

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, S. Sakamoto, Noriko Kagami et al. · Microelectronics Reliability · 2011 · 283 citations

Natural Sciences, Materials Engineering, Materials Science +8

Embedded Wafer Level Ball Grid Array (eWLB)

Tyler Meyer, G. Ofner, S. Bradl et al. · 2008 · 236 citations

Engineering, Computer Engineering, Electrical Engineering +16

Review of silver nanoparticle based die attach materials for high power/temperature applications

Seyed Amir Paknejad, S.H. Mannan · Microelectronics Reliability · 2017 · 231 citations

Natural Sciences, Materials Engineering, Materials Science +11

Embedded wafer level ball grid array (eWLB)

Markus Brunnbauer, E. F�rgut, G. Beer et al. · 2006 · 187 citations

Engineering, Computer Engineering, Electrical Engineering +16

1–5 of 93

Authors

431

GS
Gaurav Sharma
Shoolini University, India
5 publications · 161 citations
5
h-index
EB
Eric Beyne
IMEC, Belgium
5 publications · 345 citations
5
h-index
SW
Seung Wook Yoon
Institute of Microelectronics, Singapore
5 publications · 169 citations
5
h-index
RA
R. Aschenbrenner
Fraunhofer Institute for Reliability and Microintegration, Germany
5 publications · 100 citations
5
h-index
AO
Andreas Ostmann
Fraunhofer Institute for Reliability and Microintegration, Germany
5 publications · 138 citations
5
h-index

1–5 of 431

Institutions

1–8 of 87

Venues

IEEE Transactions on Components Packaging and Manufacturing Technology
9 publications · 264 citations
9
h-index
Microelectronics Reliability
7 publications · 652 citations
7
h-index
IEEE Transactions on Advanced Packaging
3 publications · 96 citations
3
h-index
Journal of Materials Science Materials in Electronics
2 publications · 55 citations
2
h-index
Materialia
1 publications · 19 citations
1
h-index

1–5