Concepedia

Noriko Kagami

NK

4

Publications

426

Citations

4

H-Index

2011

Active since

Affiliations

The University of Osaka(Current)

Osaka Research Institute of Industrial Science and Technology

Noriko Kagami is an author at The University of Osaka specializing in engineering, electronic packaging, and materials science.

Top concepts

Publications per year

2011–2020

4

Publications

4

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, S. Sakamoto, Noriko Kagami et al. · Microelectronics Reliability · 2011 · 278 citations

, , +6

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

Jinting Jiu, Hao Zhang, Shijo Nagao et al. · Journal of Materials Science · 2015 · 83 citations

, , +10

Fabrication with Semiconductor Packaging Technologies and Characterization of a Large‐Scale Flexible Thermoelectric Module

Tohru Sugahara, Yusufu Ekubaru, Ngo Van Nong et al. · Advanced Materials Technologies · 2018 · 45 citations

Fabrication and Characterization of Ultra‐Lightweight, Compact, and Flexible Thermoelectric Device Based on Highly Refined Chip Mounting

Yusufu Ekubaru, Tohru Sugahara, Kenzo Ibano et al. · Advanced Materials Technologies · 2020 · 20 citations

, , +20

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