Performance dependence of CMOS on silicon substrate orientation for ultrathin oxynitride and HfO₂ gate dielectrics

Min Yang, E. P. Gusev, M. Ieong, +8

IEEE Electron Device Letters

Semiconductor TechnologyElectrical EngineeringEngineeringCrystalline DefectsSilicon Crystal Orientation +11

A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels

Ruijie Xie, P. Montanini, Kerem Akarvardar, +84

EngineeringElectron-beam LithographyFinfet TechnologyMechanical EngineeringWafer Scale Processing +16

Sub- $10^{-9}~\Omega $ -cm2 n-Type Contact Resistivity for FinFET Technology

Hiroaki Niimi, Zuoguang Liu, Oleg Gluschenkov, +11

IEEE Electron Device Letters

SemiconductorsSemiconductor TechnologyElectrical EngineeringSemiconductor DeviceEngineering +13

Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

Timothy A. Brunner, Vinayan C. Menon, Cheuk Wun Wong, +7

Journal of Micro/Nanolithography MEMS and MOEMS

EngineeringMechanical EngineeringResidual StressWafer GeometryPhysical Design (Electronics) +16

Strained Si Channel MOSFETs with Embedded Silicon Carbon Formed by Solid Phase Epitaxy

Yaocheng Liu, Oleg Gluschenkov, Jinghong Li, +13

Electrical EngineeringEngineeringNanoelectronicsSi Channel MosfetsBias Temperature Instability +9

FinFET performance with Si:P and Ge:Group-III-Metal metastable contact trench alloys

Oleg Gluschenkov, Z. Liu, Hiroaki Niimi, +14

EngineeringSilicon On InsulatorElectronic StructureSemiconductor DeviceResistor +17

Parasitic Resistance Reduction Strategies for Advanced CMOS FinFETs Beyond 7nm

Heng Wu, Oleg Gluschenkov, Gen Tsutsui, +31

Low-power ElectronicsDevice ModelingElectrical EngineeringEngineeringVlsi Design +11

Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress

Michael Belyansky, M. A. Chace, Oleg Gluschenkov, +9

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Materials ScienceSurface TechnologyEngineeringCrystalline DefectsMaterials Characterization +13

Ti and NiPt/Ti liner silicide contacts for advanced technologies

Praneet Adusumilli, Emre Alptekin, M. Raymond, +68

Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringNanoelectronics +13

Thermally robust dual-work function ALD-MN/sub x/ MOSFETs using conventional CMOS process flow

D.-G. Park, Z. Luo, N.L. Edleman, +26

Low-power ElectronicsGate StructureElectrical EngineeringPhysical Design (Electronics)Engineering +10