Reduced electromigration of Cu wires by surface coating

C.‐K. Hu, Lynne Gignac, R. Rosenberg, +6

Applied Physics Letters

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringSurface Science +11

Plasma-assisted chemical vapor deposition of dielectric thin films for ULSI semiconductor circuits

D. Cote, S. Nguyen, A. K. Stamper, +4

IBM Journal of Research and Development

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringPlasma Processing +12

Line edge roughness and spacing effect on low-k TDDB characteristics

F. Chen, J. R. Lloyd, Kaushik Chanda, +9

Electrical EngineeringEngineeringHardware ReliabilityTime-dependent Dielectric BreakdownComputer Engineering +7

Single target sputtering of superconducting YBa2Cu3O7−δ thin films on Si (100)

M. Migliuolo, A. K. Stamper, David W. Greve, +1

Applied Physics Letters

Sub-0.25-micron interconnection scaling: damascene copper versus subtractive aluminum

A. K. Stamper, T.L. McDevitt, S.L. Luce

Aluminium NitrideEngineeringInterconnect (Integrated Circuits)High DensityWafer Scale Processing +14

Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM

D. Cote, S. Nguyen, W. Cote, +3

IBM Journal of Research and Development

Dielectric PlanarizationEngineeringMultilevel Microelectronic CircuitsVacuum DeviceChemical Deposition +14

Characterization of yttria-stabilized zirconium oxide buffer layers for high-temperature superconductor thin films

JW Lee, T. E. Schlesinger, A. K. Stamper, +3

Journal of Applied Physics

Materials ScienceYsz FilmSuperconducting MaterialHigh-tc SuperconductivityEngineering +12

Plasma-induced gate-oxide charging issues for sub-0.5 μm complementary metal–oxide–semiconductor technologies

A. K. Stamper, J. B. Lasky, J. Adkisson

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

EngineeringCharge TransportSemiconductor DevicePlasma ElectronicsGate-oxide Degradation +15

Planar MEMS RF capacitor integration

A. K. Stamper, C. Jahnes, Sandra R. Dupuis, +12

EngineeringRadio FrequencyMicroelectromechanical SystemsMems CavitiesIntegrated Circuits +16

Hysteresis model for polycrystalline high-<i>T</i> <i>c</i> superconductors

Daniel D. Stancil, T. E. Schlesinger, A. K. Stamper, +1

Journal of Applied Physics

Superconducting MaterialEngineeringBismuth-based SuperconductorsApproximate ModelMagnetic Materials +17