A. K. Stamper

Reduced electromigration of Cu wires by surface coating

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2002 · 215 citations

Materials Science, Electrical Engineering, Electromigration Technique +13

Plasma-assisted chemical vapor deposition of dielectric thin films for ULSI semiconductor circuits

D. Cote, S. Nguyen, A. K. Stamper et al. · IBM Journal of Research and Development · 1999 · 96 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Line edge roughness and spacing effect on low-k TDDB characteristics

F. Chen, J. R. Lloyd, Kaushik Chanda et al. · 2008 · 46 citations

Electrical Engineering, Engineering, Hardware Reliability +9

Single target sputtering of superconducting YBa2Cu3O7−δ thin films on Si (100)

M. Migliuolo, A. K. Stamper, David W. Greve et al. · Applied Physics Letters · 1989 · 43 citations

Sub-0.25-micron interconnection scaling: damascene copper versus subtractive aluminum

A. K. Stamper, T.L. McDevitt, S.L. Luce · 2002 · 42 citations

Aluminium Nitride, Engineering, Interconnect (Integrated Circuits) +16