S. Nguyen

Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

A. Grill, S. M. Gates, Todd E. Ryan et al. · Applied Physics Reviews · 2014 · 283 citations · Full text

Engineering, Device Integration, Advanced Low K +19

Plasma-assisted chemical vapor deposition of dielectric thin films for ULSI semiconductor circuits

D. Cote, S. Nguyen, A. K. Stamper et al. · IBM Journal of Research and Development · 1999 · 96 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Reaction Mechanisms of Plasma‐ and Thermal‐Assisted Chemical Vapor Deposition of Tetraethylorthosilicate Oxide Films

S. Nguyen, D. Dobuzinsky, D. Harmon et al. · Journal of The Electrochemical Society · 1990 · 91 citations

Engineering, Cvd Films, Thin Film Process Technology +17

CVD of fluorosilicate glass for ULSI applications

M. J. Shapiro, S. Nguyen, T. Matsuda et al. · Thin Solid Films · 1995 · 67 citations

Materials Engineering, Materials Science, Engineering +4

High-density plasma chemical vapor deposition of silicon-based dielectric films for integrated circuits

S. Nguyen · IBM Journal of Research and Development · 1999 · 61 citations

Engineering, Hdp Cvd, Silicon-based Dielectric Films +16