Concepedia

Todd E. Ryan

TE

2

Publications

300

Citations

2

H-Index

2010

Active since

Affiliations

GlobalFoundries (United States)(Current)

Todd E. Ryan is an author at GlobalFoundries (United States) specializing in electronic packaging, applied physics, and electrical insulation.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsElectronic PackagingElectrical InsulationElectrical EngineeringSurface ScienceAdvanced PackagingIntegrated Circuits

Publications per year

2010–2014

2

Publications

2

Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

A. Grill, S. M. Gates, Todd E. Ryan et al. · Applied Physics Reviews · 2014 · 283 citations · Full text

Engineering, Device Integration, Advanced Low K +19

High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility

T. Nogami, T. Bolom, A. Simon et al. · 2010 · 17 citations

Engineering, Nm Beol, Interconnect (Integrated Circuits) +16

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