J. Bömmels

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Liang Wen, Philippe Roussel, Olalla Varela Pedreira et al. · ACS Applied Materials & Interfaces · 2016 · 138 citations

Highly Scaled Ruthenium Interconnects

Shibesh Dutta, Shreya Kundu, Anshul Gupta et al. · IEEE Electron Device Letters · 2017 · 90 citations

Materials Science, Stanene, Electrical Engineering +10

Alternative metals for advanced interconnects

Christoph Adelmann, Liang Wen, Antony Premkumar Peter et al. · 2014 · 87 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Sub-100 nm² Cobalt Interconnects

Shibesh Dutta, Sofie Beyne, Anshul Gupta et al. · IEEE Electron Device Letters · 2018 · 82 citations

Electrical Engineering, High-tc Superconductivity, Engineering +14

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Olalla Varela Pedreira, Kristof Croes, A. Leśniewska et al. · 2017 · 77 citations

Reliability Study, Engineering, Beol Interconnects +17