C. Parks

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

Y. Liu, J. Wang, Liang Yin et al. · Journal of Applied Electrochemistry · 2008 · 81 citations

Materials Science, Electrical Engineering, Electroplated Copper–solder Interface +5

CVD Co and its application to Cu damascene interconnections

T. Nogami, J. Maniscalco, Anita Madan et al. · 2010 · 43 citations

Materials Science, Materials Engineering, Cvd Co +15

Improving Copper Electrodeposition in the Microelectronics Industry

Yihua Liu, Liang Yin, Stoyan Bliznakov et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 41 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Electromigration comparison of selective CVD cobalt capping with PVD Ta(N) and CVD cobalt liners on 22nm-groundrule dual-damascene Cu interconnects

A. Simon, T. Bolom, Chunping Niu et al. · 2013 · 40 citations

Engineering, Electrode-electrolyte Interface, Interconnect (Integrated Circuits) +16

Leveler Effect and Oscillatory Behavior during Copper Electroplating

Qiang Huang, Brett Baker-O'Neal, C. Parks et al. · Journal of The Electrochemical Society · 2012 · 35 citations

Engineering, Electrode-electrolyte Interface, Chemical Deposition +18