Y. Liu

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

Y. Liu, J. Wang, Liang Yin et al. · Journal of Applied Electrochemistry · 2008 · 81 citations

Materials Science, Electrical Engineering, Electroplated Copper–solder Interface +5

Comprehensive Study of the Application of a Pb Underpotential Deposition-Assisted Method for Surface Area Measurement of Metallic Nanoporous Materials

Y. Liu, Stoyan Bliznakov, Nikolay Dimitrov · The Journal of Physical Chemistry C · 2009 · 81 citations

Engineering, Nanoporous Material, Electrode-electrolyte Interface +20

Modeling of power/ground plane noise in high speed digital electronics packaging

Jiarui Fang, Y. Liu, Yuxu Chen et al. · 2002 · 33 citations

Electrical Engineering, Engineering Noise Control, Engineering +11

Mechanochemical synthesis, thermal stability and selective electrochemical dissolution of Cu–Ag solid solutions

Lyudmila Lyubenova, Y. Liu, Stoyan Bliznakov et al. · Journal of Alloys and Compounds · 2008 · 31 citations

Materials Science, Chemical Engineering, Selective Electrochemical Dissolution +8

Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell

Fred Wafula, Y. Liu, Liang Yin et al. · Journal of Applied Electrochemistry · 2011 · 25 citations

Materials Science, Materials Engineering, Electrical Engineering +12