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Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

DOI

81

Citations

28

References

2008

Year

Y. Liu, J. Wang, Liang Yin, Pericles A. Kondos, C. Parks, D. W. Henderson, E. J. Cotts, Nikolay Dimitrov
Journal of Applied Electrochemistry

References

YearCitations

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