Concepedia
Statistics
Publications
6
Citations
247
H-Index
Active since
2007
Affiliations
Binghamton University(Current)
IBM (United States)
Ithaca College
Universal Instruments (United States)
Pericles A. Kondos is an author at Binghamton University specializing in engineering, materials science, and materials engineering.
Top concepts
EngineeringMaterial ScienceMaterials EngineeringElectrical EngineeringTechnologyReliabilityMicrostructureApplied PhysicsDefect ToleranceElectrochemistry
Publications per year
2007–2011
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface
Y. Liu, J. Wang, Liang Yin et al. · Journal of Applied Electrochemistry · 2008 · 81 citations
Materials Science, Electrical Engineering, Electroplated Copper–solder Interface +5
Assessing the risk of “Kirkendall voiding” in Cu3Sn
Peter Børgesen, Liang Yin, Pericles A. Kondos · Microelectronics Reliability · 2010 · 43 citations
Reliability, Materials Engineering, Reliability Engineering +4
Improving Copper Electrodeposition in the Microelectronics Industry
Yihua Liu, Liang Yin, Stoyan Bliznakov et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 41 citations
Materials Science, Materials Engineering, Electrical Engineering +14
Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids!
Peter Børgesen, Liang Yin, Pericles A. Kondos et al. · 2007 · 38 citations
Engineering, Surface Integrity, Defect Tolerance +22
Acceleration of the growth of Cu3Sn voids in solder joints
Peter Børgesen, Liang Yin, Pericles A. Kondos · Microelectronics Reliability · 2011 · 25 citations
Materials Science, Materials Engineering, Engineering +10
1–5 of 6