Fred Wafula

All Electrochemical Fabrication of a Platinized Nanoporous Au Thin-Film Catalyst

Daniel A. McCurry, Martha Kamundi, Matthew Fayette et al. · ACS Applied Materials & Interfaces · 2011 · 51 citations

Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding

Liang Yin, Fred Wafula, Nikolay Dimitrov et al. · Journal of Electronic Materials · 2011 · 41 citations

Materials Science, Materials Engineering, Electrical Engineering +11

Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization

Jun Wu, Fred Wafula, Sean P. Branagan et al. · Journal of The Electrochemical Society · 2018 · 36 citations · Full text

Engineering, Cobalt Plating, Single Additive Bath +19

Impact of Key Deposition Parameters on the Voiding Sporadically Occurring in Solder Joints with Electroplated Copper

Fred Wafula, Y. Liu, Liang Yin et al. · Journal of The Electrochemical Society · 2009 · 31 citations

Impurity Incorporation Process, Engineering, Mechanical Engineering +18

Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

Fred Wafula, Liang Yin, Dickson Andala et al. · Journal of Electronic Materials · 2012 · 30 citations

Materials Science, Materials Engineering, Electrical Engineering +9