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Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

Materials ScienceMaterials EngineeringElectrical EngineeringEthylene GlycolEngineeringElectromigration TechniqueCorrosionPolymer StabilityPolymer ScienceSolder JointsElectronic PackagingElectroplated Cu