Brett Baker-O'Neal

Leveler Effect and Oscillatory Behavior during Copper Electroplating

Qiang Huang, Brett Baker-O'Neal, C. Parks et al. · Journal of The Electrochemical Society · 2012 · 35 citations

Engineering, Electrode-electrolyte Interface, Chemical Deposition +18

Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives

Qiang Huang, Alex Avekians, S. Reaz Ahmed et al. · Journal of The Electrochemical Society · 2014 · 29 citations · Full text

Cu Films, Engineering, Nm Cu Lines +17

Suppressor Effects during Copper Superfilling of Sub-100 nm Lines

Qiang Huang, Brett Baker-O'Neal, James J. Kelly et al. · Electrochemical and Solid-State Letters · 2009 · 25 citations

Suppressor Effects, Superconducting Material, Engineering +6

Enhanced Grain Growth of Electroplated Copper on Cobalt-Containing Seed Layer

Qiang Huang, Brett Baker-O'Neal, C. Cabral et al. · Journal of The Electrochemical Society · 2013 · 17 citations · Full text

Materials Engineering, Materials Science, Chemical Engineering +15

Electroplating of Fe-Rich NiFe Alloys in Sub-50 nm Lines

D. Liang, J. Liu, Kathleen B. Reuter et al. · Journal of The Electrochemical Society · 2014 · 16 citations · Full text

Engineering, Different Additives, Mechanical Engineering +17