Dale McHerron

Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages

A. Deutsch, Madhavan Swaminathan, Moonhor Ree et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 31 citations

Bpda-pda Polyimide, Engineering, Thin Film Process Technology +16

Aggressively Scaled Strained-Silicon-on-Insulator Undoped-Body High- $\kappa$/Metal-Gate nFinFETs for High-Performance Logic Applications

K. Maitra, A. Khakifirooz, Pranita Kulkarni et al. · IEEE Electron Device Letters · 2011 · 28 citations

Semiconductors, High-performance Logic Applications, Electrical Engineering +15

Apparent reversal of physical ageing in amorphous glassy polymers by electron beam irradiation

Dale McHerron, Garth L. Wilkes · Polymer · 1993 · 19 citations

Materials Science, Apparent Reversal, Engineering +10

Surface Energy Characterization for Die-Level Cu Hybrid Bonding

Katsuyuki Sakuma, Roy Yu, Michael Belyansky et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 14 citations

Voids-free Die-level Cu/ILD Hybrid bonding

Katsuyuki Sakuma, Roy Yu, Nicholas A. Polomoff et al. · 2023 · 14 citations