O. Louveau

Mechanisms of porous dielectric film modification induced by reducing and oxidizing ash plasmas

N. Possémé, T. Chevolleau, Maxime Darnon et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2007 · 78 citations · Full text

Engineering, Nanoporous Material, Oxidation Resistance +16

Challenges of back end of the line for sub 65 nm generation

M. Fayolle, G. Passemard, O. Louveau et al. · Microelectronic Engineering · 2003 · 49 citations

Low-power Electronics, Electrical Engineering, Engineering +10

Three dimensional chip stacking using a wafer-to-wafer integration

Ritwik Chatterjee, Marc Zussy, Antonio Roman et al. · 2007 · 38 citations

Engineering, Dimensional Chip, Wafer Scale Processing +16

Dry ashing process evaluation for porous ULK films

O. Louveau · Microelectronic Engineering · 2004 · 29 citations

Materials Engineering, Materials Science, Porous Ulk Films +4

Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology

M. Fayolle, J. Torrès, G. Passemard et al. · Microelectronic Engineering · 2002 · 26 citations

Materials Science, Electrical Engineering, Engineering +8