Concepedia

Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology

M. Fayolle, J. Torrès, G. Passemard, Florence Fusalba, Gilles L. Fanget, D. Louis, M. Assous, O. Louveau, M. Rivoire, K. Haxaire,

Microelectronic Engineering · 2002 · 26 citations · 1 references

DOI

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References

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Integration of copper with an organic low-k dielectric in 0.12-μm node interconnect

M. Fayolle, G. Passemard, M. Assous et al. · Microelectronic Engineering · 2002 · 24 citations

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