M. Fayolle

Challenges for 3D IC integration: bonding quality and thermal management

Patrick Leduc, N. Sillon, Didier Louis et al. · 2007 · 95 citations

Engineering, Materials Engineering, Materials Science +14

Carbon nanotubes for interconnects in future integrated circuits: The challenge of the density

Jean Dijon, A. Fournier, P. D. Szkutnik et al. · Diamond and Related Materials · 2009 · 60 citations

Engineering, Electrical Engineering, Materials Science +12

Copper CMP evaluation: planarization issues

M. Fayolle, F. Romagna · Microelectronic Engineering · 1997 · 58 citations

Engineering, Materials Engineering, Metallurgy +5

Challenges of back end of the line for sub 65 nm generation

M. Fayolle, G. Passemard, O. Louveau et al. · Microelectronic Engineering · 2003 · 49 citations

Engineering, Computer Engineering, Electrical Engineering +11

Ultra-high density carbon nanotubes on Al-Cu for advanced vias

Jean Dijon, Hanako Okuno, M. Fayolle et al. · 2010 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +9