A high performance 1.8 V, 0.20 μm CMOS technology with copper metallization

S. Venkatesan, A. V. Gelatos, S. Hisra, +36

High Performance 0.20EngineeringVlsi DesignComputer ArchitectureμM Cmos Technology +17

A molecular dynamics investigation of fluorocarbon based layer-by-layer etching of silicon and SiO2

Shahid Rauf, T. Sparks, Peter L. G. Ventzek, +3

Journal of Applied Physics

EngineeringIntegrated CircuitsChemistrySilicon On InsulatorSemiconductors +19

Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies

P. Zürcher, P. Alluri, Peir-Yung Chu, +16

Materials ScienceElectrical EngineeringSheet ResistanceNegative Temperature CoefficientEngineering +12

Three dimensional chip stacking using a wafer-to-wafer integration

Ritwik Chatterjee, Marc Zussy, Antonio Roman, +18

EngineeringDimensional ChipWafer Scale ProcessingAdvanced Packaging (Semiconductors)Precise Wafer-to-wafer Alignment +14

The Use of Unsaturated Fluorocarbons for Dielectric Etch Applications

Ritwik Chatterjee, Simon Karecki, R. Reif, +2

Journal of The Electrochemical Society

EngineeringOrganic ElectronicsOrganic ChemistryChemistryChemical Engineering +14

22 nm technology compatible fully functional 0.1 μm<sup>2</sup> 6T-SRAM cell

Bala S. Haran, A. Kumar, Lahir Shaik Adam, +44

Functional 0.1Nm TechnologyElectrical EngineeringEngineeringVlsi Design +9

Use of Novel Hydrofluorocarbon and Iodofluorocarbon Chemistries for a High Aspect Ratio Via Etch in a High Density Plasma Etch Tool

Simon Karecki, Laura Pruette, R. Reif, +3

Journal of The Electrochemical Society

Hdp Etch ToolChemical EngineeringFourier TransformEngineeringMicrofabrication +11

SON (silicon-on-nothing) technological CMOS platform: highly performant devices and SRAM cells

S. Monfray, D. Chanemougame, S. Borel, +13

Sram CellsEngineeringVlsi DesignSon ProcessPerformant Nmos +15

Integrated equipment-feature modeling investigation of fluorocarbon plasma etching of SiO2 and photoresist

Da Zhang, Shahid Rauf, T. Sparks, +1

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

EngineeringElectron-beam LithographyIntegrated CircuitsPlasma ProcessingPlasma Discharges +18

A versatile 0.13 μm CMOS platform technology supporting high performance and low power applications

A.H. Perera, B. Smith, N. Cave, +48

Low Power ApplicationsEngineeringVlsi DesignNm Krf LithographyDevice Integration +15