T. Sparks

A high performance 1.8 V, 0.20 μm CMOS technology with copper metallization

S. Venkatesan, A. V. Gelatos, S. Hisra et al. · 2002 · 101 citations

Engineering, Computer Engineering, Electrical Engineering +17

A molecular dynamics investigation of fluorocarbon based layer-by-layer etching of silicon and SiO2

Shahid Rauf, T. Sparks, Peter L. G. Ventzek et al. · Journal of Applied Physics · 2007 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +17

Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies

P. Zürcher, P. Alluri, Peir-Yung Chu et al. · 2002 · 63 citations

Engineering, Electrical Engineering, Materials Science +17

The Use of Unsaturated Fluorocarbons for Dielectric Etch Applications

Ritwik Chatterjee, Simon Karecki, R. Reif et al. · Journal of The Electrochemical Society · 2002 · 38 citations

Engineering, Chemical Engineering, Environmental Engineering +13

Three dimensional chip stacking using a wafer-to-wafer integration

Ritwik Chatterjee, Marc Zussy, Antonio Roman et al. · 2007 · 38 citations

Engineering, Electrical Engineering, Materials Science +17