B. Eyckens

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 190 citations

Engineering, Mechanical Engineering, Extreme Wafer Thinning +19

Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation

Francesca Iacopi, Youssef Travaly, B. Eyckens et al. · Journal of Applied Physics · 2006 · 133 citations

Optical Materials, Ultraviolet Radiation, Engineering +18

Performance Enhancement of MUGFET Devices Using Super Critical Strained-SOI (SC-SSOI) and CESL

Nadine Collaert, R. Rooyackers, Francesca Clemente et al. · 2006 · 54 citations

Tensile Strain, Electrical Engineering, Performance Enhancement +10

Performance improvement of tall triple gate devices with strained SiN layers

Nadine Collaert, A. De Keersgieter, K.G. Anil et al. · IEEE Electron Device Letters · 2005 · 49 citations

Electrical Engineering, Engineering, Vlsi Design +11

Highly reliable and extremely stable SiGe micro-mirrors

Maria Gromova, P. A. Muller, T. Lauwagie et al. · 2007 · 17 citations

Engineering, Micro-optical Component, Silicon On Insulator +16