L. Böttcher

Publications

206

Citations

H-Index

2003

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

L. Böttcher is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectronic Packaging3D PrintingMicrofabricationElectrical EngineeringMaterial ScienceFlexible ElectronicsNanoelectronicsPower Electronics

Publications per year

2003–2022

Publications

Realization of a stackable package using chip in polymer technology

Andreas Ostmann, Alexander Neumann, Sascha Weser et al. · 2003 · 36 citations

Engineering, Polymer Technology, Advanced Packaging (Semiconductors) +20

Large area embedding for heterogeneous system integration

Tanja Braun, K.-F. Becker, L. Böttcher et al. · 2010 · 25 citations

Large Area, Cluster Computing, Transfer Molding +23

Trends in Fan-out wafer and panel level packaging

Tanja Braun, Karl‐Friedrich Becker, Markus Wöhrmann et al. · 2017 · 18 citations

Engineering, Computer Architecture, Latest Packaging Trends +17

Thermoelectric Characterization of Zone-Melted and Quenched Zn4Sb3

Christian Stiewe, Titas Dasgupta, L. Böttcher et al. · Journal of Electronic Materials · 2009 · 17 citations

Materials Science, Engineering, Applied Physics +5

Panel Level Packaging – Where are the Technology Limits?

Tanja Braun, O. Hölck, Mattis Obst et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 17 citations

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