L. Böttcher - Concepedia

Author

L. Böttcher

Fraunhofer Institute for Reliability and Microintegration

Also Known As

Biro, D., Bottcher, L., Böttcher, Lars, Koch, Raphael, L. Bottcher, L. Böttcher, Lars Bottcher, Lars Böttcher, Lena Böttcher

119

Publications

280

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Technische Universität Berlin

About

L. Böttcher is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	152
2	Computer Engineering	2	2	61
3	Applied Physics	1	1	17
4	Biomedical Engineering	1	1	25
5	Computer Science	1	1	25

L. Böttcher

Publications

206

Citations

H-Index

Page 1

	Year	Citations
Realization of a stackable package using chip in polymer technology Andreas Ostmann, Alexander Neumann, Sascha Weser, EngineeringPolymer TechnologyAdvanced Packaging (Semiconductors)Electronic PackagingChip Size Packages	2003	36
Large area embedding for heterogeneous system integration Tanja Braun, K.-F. Becker, L. Böttcher, Large AreaCluster ComputingTransfer MoldingHeterogeneous ComputingEngineering	2010	25
Trends in Fan-out wafer and panel level packaging Tanja Braun, Karl‐Friedrich Becker, Markus Wöhrmann, EngineeringComputer ArchitectureLatest Packaging TrendsWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2017	18
Thermoelectric Characterization of Zone-Melted and Quenched Zn4Sb3 Christian Stiewe, Titas Dasgupta, L. Böttcher, Journal of Electronic Materials Materials ScienceEngineeringApplied PhysicsCondensed Matter PhysicsThermoelectric Characterization	2009	17
Panel Level Packaging – Where are the Technology Limits? Tanja Braun, O. Hölck, Mattis Obst, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)	2022	17
Characteristics and aging of PCB embedded power electronics R. Randoll, Mahmud Asef, W. Wondrak, Microelectronics Reliability Electrical EngineeringEngineeringHardware ReliabilityPower DeviceCircuit Reliability	2015	17
Advanced Turbocharger Model for 1D ICE Simulation - Part I Panagiotis Grigoriadis, Emanuel Binder, L. Böttcher, SAE technical papers on CD-ROM/SAE technical paper series	2013	16
Compact power electronic modules realized by PCB embedding technology Thomas Löher, S. Karaszkiewicz, L. Böttcher, EngineeringPower Electronic SystemsPower ElectronicsElectronic DevicesAdvanced Packaging (Semiconductors)	2016	15
Lamination and laser structuring for a microwell array Erik Jung, Dion Manessis, Alexander Neumann, Microsystem Technologies EngineeringMicrofabricationLaser Micro-processingMicrowell ArrayMechanical Engineering	2007	12
Highly integrated flexible electronic Circuits and Modules Thomas Löher, Manuel Seckel, Barbara Pahl, Flexible Electronic CircuitsEngineeringDevice IntegrationFlexible Manufacturing TechnologyMechanical Engineering	2008	12

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