Trends in Fan-out wafer and panel level packaging

Abstract

The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies that also allow large area processing and 3D integration with strong potential for low cost applications. Here, Fan-Out Wafer Level Packaging [FOWLP] is one of the latest packaging trends in microelectronics. Besides developments to higher and heterogeneous integration the movement to larger formats and panel level packaging to lower cost is noticeable.