Statistics
Publications
10
Citations
209
H-Index
10
Active since
2015
Markus Wöhrmann is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, fan-out wafer-level packaging, and packaging engineering.
Publications per year
2015–2020
10
10
Panel Level Packaging - A View Along the Process Chain
Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 40 citations
Engineering, Manufacturing Engineering, Manufacturing Processes +13
Development of a Multi-project Fan-Out Wafer Level Packaging Platform
Tanja Braun, S. Raatz, Marius van Dijk et al. · 2017 · 32 citations
Engineering, Electrical Engineering, Electronic Materials +16
Fan-out Wafer Level Packaging of GaN Components for RF Applications
Tanja Braun, S. Voges, Markus Wöhrmann et al. · 2020 · 24 citations
Engineering, Electrical Engineering, Materials Engineering +17
Material and process trends for moving from FOWLP to FOPLP
Tanja Braun, S. Voges, Michael J. Topper et al. · 2015 · 23 citations
Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2019 · 22 citations
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