K. Motoyama

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang et al. · 2018 · 70 citations

Engineering, Electrical Engineering, Materials Science +17

Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects

Nicholas A. Lanzillo, K. Choi, C.-C. Yang et al. · IEEE Electron Device Letters · 2019 · 47 citations

Engineering, Electrical Engineering, Materials Science +17

BEOL process integration for the 7 nm technology node

T. Standaert, Genevieve Beique, H.-C. Chen et al. · 2016 · 35 citations

Engineering, Electrical Engineering, Materials Science +12

An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines

Ryan Smith, E. Todd Ryan, C.‐K. Hu et al. · AIP Advances · 2019 · 32 citations · Full text

Natural Sciences, Materials Science, Physics +16

Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node

T. Nogami, Xingxing Zhang, James J. Kelly et al. · 2017 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +10