S. Sahhaf

Review of reliability issues in high-k/metal gate stacks

R. Degraeve, M. Aoulaiche, B. Kaczer et al. · 2008 · 64 citations

Reliability, Reliability Issues, Electrical Engineering +11

A New TDDB Reliability Prediction Methodology Accounting for Multiple SBD and Wear Out

S. Sahhaf, R. Degraeve, Philippe Roussel et al. · IEEE Transactions on Electron Devices · 2009 · 33 citations

Engineering, System Reliability, Reliability Engineering +21

Methodologies for sub-1nm EOT TDDB evaluation

T. Kauerauf, R. Degraeve, Lars‐Åke Ragnarsson et al. · 2011 · 25 citations

Engineering, Tddb Reliability, Computer Architecture +22

TDDB Reliability Prediction Based on the Statistical Analysis of Hard Breakdown Including Multiple Soft Breakdown and Wear-out

S. Sahhaf, R. Degraeve, Ph. J. Roussel et al. · 2007 · 22 citations

Engineering, Statistical Analysis, Reliability Engineering +17

A consistent model for the hard breakdown distribution including digital soft breakdown: the noble art of area scaling

Ph. Roussel, R. Degraeve, S. Sahhaf et al. · Microelectronic Engineering · 2007 · 17 citations

Reliability Engineering, Engineering, Reliability Modelling +9