Gaspard Hiblot

Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

Rongmei Chen, Melina Lofrano, Gioele Mirabelli et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 38 citations

Engineering, Computer Engineering, Electrical Engineering +17

PPA and Scaling Potential of Backside Power Options in N2 and A14 Nanosheet Technology

Sheng Yang, P. Schuddinck, M. García-Bardon et al. · 2023 · 34 citations

Engineering, Computer Engineering, Electrical Engineering +16

CFET SRAM With Double-Sided Interconnect Design and DTCO Benchmark

Hsiao-Hsuan Liu, P. Schuddinck, Zhenlin Pei et al. · IEEE Transactions on Electron Devices · 2023 · 32 citations

Engineering, Computer Engineering, Electrical Engineering +17

Refined Conformal Mapping Model for MOSFET Parasitic Capacitances Based on Elliptic Integrals

Gaspard Hiblot, Quentin Rafhay, Gerard Ghibaudo · IEEE Transactions on Electron Devices · 2015 · 24 citations

Engineering, Computer Engineering, Electrical Engineering +17

Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node

Rongmei Chen, Giuliano Sisto, Anne Jourdain et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 24 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17