Jeffrey Smith

Perspective: New process technologies required for future devices and scaling

Robert D. Clark, Kandabara Tapily, K.H. Yu et al. · APL Materials · 2018 · 180 citations · Full text

Engineering, Device Integration, Process Development +23

Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab

Chris Bencher, Jeffrey Smith, Liyan Miao et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2011 · 106 citations

Directed self-assembly defectivity assessment. Part II

Chris Bencher, He Yi, Jessica Zhou et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2012 · 67 citations

Engineering, Mechanical Engineering, Defect Tolerance +20

CFET Design Options, Challenges, and Opportunities for 3D Integration

Lars W. Liebmann, Jeffrey Smith, D. Chanemougame et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 29 citations

Engineering, Vlsi Design, Cfet Design Options +20

Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme

Nihar Mohanty, Elliott Franke, Eric Liu et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2015 · 17 citations

Resist Trim Etch, Electrical Engineering, Engineering +15