Publication | Closed Access
CFET Design Options, Challenges, and Opportunities for 3D Integration
29
Citations
1
References
2021
Year
EngineeringVlsi DesignCfet Design Options3D ModelingComputer-aided DesignIntegrated CircuitsCfet Technology-architecture DefinitionAdvanced DesignAdvanced Packaging (Semiconductors)Integrated Circuit DesignDesign DetailsGeometric Modeling3D Ic ArchitectureElectrical EngineeringComputer EngineeringMicroelectronics3D PrintingStandard CellAerospace EngineeringThree-dimensional Heterogeneous IntegrationNatural SciencesBeyond Cmos3D Integration
Design details of standard cell architectures using complementary field effect transistors (CFET) are explored. The primary structural elements of CFET are reviewed and the layout impact of several 2 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">nd</sup> -order technology constructs is analyzed. A manufacturability assessment and cost analysis of the resulting CFET technology-architecture definition is presented. Finally, the extendibility of CFET to 3.5-track cell height as well as higher-order 3D integration is explored.
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