Electroless plating of low-resistivity Cu–Mn alloy thin films with self-forming capacity and enhanced thermal stability

Estimation of the surface free energy of polymers

D.K. Owens, R. C. Wendt · Journal of Applied Polymer Science · 1969 · 9.2K citations

Natural Sciences, Chemistry, Physics +17

Static solvent contact angle measurements, surface free energy and wettability determination of various self-assembled monolayers on silicon dioxide

Dimitri Janssen, Randy De Palma, Stijn Verlaak et al. · Thin Solid Films · 2006 · 452 citations

Natural Sciences, Chemistry, Materials Science +17

Self-forming diffusion barrier layer in Cu–Mn alloy metallization

Junichi Koike, M. Wada · Applied Physics Letters · 2005 · 262 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Comparison of the agglomeration behavior of thin metallic films on SiO2

Parag Gadkari, Andrew P. Warren, R Todi et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2005 · 164 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +9

On the use of alloying elements for Cu interconnect applications

Katayun Barmak, C. Cabral, K. P. Rodbell et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +17