Andrew P. Warren

Surface and grain-boundary scattering in nanometric Cu films

Tik Sun, Bo Yao, Andrew P. Warren et al. · Physical Review B · 2010 · 216 citations

Materials Science, Materials Engineering, Surface Characterization +13

Comparison of the agglomeration behavior of thin metallic films on SiO2

Parag Gadkari, Andrew P. Warren, R Todi et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2005 · 162 citations

Materials Engineering, Materials Science, Surface Characterization +14

Dominant role of grain boundary scattering in the resistivity of nanometric Cu films

Tik Sun, Bo Yao, Andrew P. Warren et al. · Physical Review B · 2009 · 117 citations

Engineering, Dominant Role, Metallic Nanomaterials +16

Phase, grain structure, stress, and resistivity of sputter-deposited tungsten films

Dooho Choi, Bincheng Wang, Suk Jae Chung et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2011 · 116 citations

Engineering, Thin Film Process Technology, Epitaxial Growth +17

Surface and grain boundary scattering in nanometric Cu thin films: A quantitative analysis including twin boundaries

Katayun Barmak, Amith Darbal, K. J. Ganesh et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2014 · 94 citations

Engineering, Electron Diffraction, Twin-boundary Scattering +19