Surface and grain-boundary scattering in nanometric Cu films

Tik Sun, Bo Yao, Andrew P. Warren, +4

Physical Review B

Materials ScienceMaterials EngineeringSurface CharacterizationNanometric Cu FilmsEngineering +11

Dominant role of grain boundary scattering in the resistivity of nanometric Cu films

Tik Sun, Bo Yao, Andrew P. Warren, +4

Physical Review B

EngineeringDominant RoleMetallic NanomaterialsThin Film Process TechnologyGrain Size +14

Surface and grain boundary scattering in nanometric Cu thin films: A quantitative analysis including twin boundaries

Katayun Barmak, Amith Darbal, K. J. Ganesh, +6

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

EngineeringElectron DiffractionTwin-boundary ScatteringCrystal Orientation MapsQuantitative Analysis +17

Grain Boundary Character Distribution of Nanocrystalline Cu Thin Films Using Stereological Analysis of Transmission Electron Microscope Orientation Maps

Amith Darbal, K. J. Ganesh, Xiang-Yang Liu, +10

Microscopy and Microanalysis

Classical size effect in oxide-encapsulated Cu thin films: Impact of grain boundaries versus surfaces on resistivity

Tik Sun, Bo Yao, Andrew P. Warren, +4

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Thin Film PhysicsEngineeringThin Film Process TechnologyCu Thin FilmsGrain Boundaries +14

High contrast hollow-cone dark field transmission electron microscopy for nanocrystalline grain size quantification

Bo Yao, Tik Sun, Andrew P. Warren, +3

Micron

Materials ScienceEngineeringElectron MicroscopyMicroscopyNanotechnology +5

On twin density and resistivity of nanometric Cu thin films

Katayun Barmak, Xuan Liu, Amith Darbal, +6

Journal of Applied Physics

NanosheetEngineeringThin Film Process TechnologyTwin DensityCrystal Orientation Mapping +15

Relaxation time effects on dynamic conductivity of alloyed metallic thin films in the infrared band

David Shelton, Tik Sun, James C. Ginn, +2

Journal of Applied Physics

EngineeringRelaxation TimeRelaxation Time EffectsCharge TransportInfrared Band +14

Grain Growth and the Puzzle of its Stagnation in Thin Films a Detailed Comparison of Experiments and Simulations

Katayun Barmak, Eva Eggeling, Richard Sharp, +8

Materials science forum

Materials ScienceEngineeringSevere Plastic DeformationPhysicsGrain Growth +13

Impact Of Surface And Grain Boundary Scattering On The Resistivity Of Nanometric Cu Interconnects

Katayun Barmak, Tik Sun, R. Coffey, +3

AIP conference proceedings

EngineeringLine WidthGrain SizeInterconnect (Integrated Circuits)Nanoelectronics +16