Concepedia

Sung‐Te Chen

SC

Statistics

Publications

5

Citations

79

H-Index

5

Active since

2015

Affiliations

Feng Chia University(Current)

Hsiuping University of Science and Technology

National Formosa University

National Chi Nan University

Sung‐Te Chen is an author at Feng Chia University specializing in materials science, materials engineering, and electroless plating.

Publications per year

2015–2018

5

Publications

5

A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier

Giin-Shan Chen, Tzu-Ming Yang, Sung‐Te Chen et al. · Electrochemistry Communications · 2017 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution

Sung‐Te Chen, Yu-Syun Cheng, Yiu-Hsiang Chang et al. · Applied Surface Science · 2018 · 20 citations

Engineering, Materials Engineering, Materials Science +16

Electroless plating of low-resistivity Cu–Mn alloy thin films with self-forming capacity and enhanced thermal stability

Sung‐Te Chen, Giin-Shan Chen · Journal of Alloys and Compounds · 2015 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16

Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process

Sung‐Te Chen, Yuan-Yu Liu, Giin-Shan Chen · Applied Surface Science · 2015 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +17

Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers

Sung‐Te Chen, Yu-Cheng Chung, Jau-Shiung Fang et al. · Applied Surface Science · 2017 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +16

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