Yiu-Hsiang Chang

Communication—Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass

Yiu-Hsiang Chang, Pei-Lien Tseng, Jen‐Chieh Lin et al. · Journal of The Electrochemical Society · 2018 · 32 citations · Full text

Engineering, Materials Engineering, Materials Science +10

Process integration of 3D Si interposer with double-sided active chip attachments

Pei-Jer Tzeng, John H. Lau, Chau‐Jie Zhan et al. · 2013 · 25 citations

Engineering, Electrical Engineering, Microelectronics +16

Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution

Sung‐Te Chen, Yu-Syun Cheng, Yiu-Hsiang Chang et al. · Applied Surface Science · 2018 · 20 citations

Engineering, Materials Engineering, Materials Science +16

Fine-pitch backside via-last TSV process with optimization on temporary glue and bonding conditions

Erh-Hao Chen, Tzu‐Chien Hsu, Cha-Hsin Lin et al. · 2013 · 16 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +15

Preparation and properties of yttrium iron garnet microcrystal in P2O5–MgO glass

G.J. Chen, H.M. Lee, Yiu-Hsiang Chang et al. · Journal of Alloys and Compounds · 2004 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +14