Concepedia
Microelectronics Reliability · 2015 · 12 citations · 12 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials CharacterizationMaterials PhysicsMetalsResidual StressIntrinsic StressStress-strain Curve AnalysisTungsten InterconnectsTungsten-based Materials
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Two-dimensional detector software: From real detector to idealised image or two-theta scan
A. P. Hammersley, Sigfrid Svensson, Michael Hanfland et al. · High Pressure Research · 1996 · 4.7K citations
Natural Sciences, Materials Science, Physics +17
Tensile and compressive behavior of tungsten, molybdenum, tantalum and niobium at the nanoscale
Ju‐Young Kim, Dongchan Jang, Julia R. Greer · Acta Materialia · 2010 · 360 citations
Natural Sciences, Materials Engineering, Materials Science +11
X-ray nanodiffraction reveals strain and microstructure evolution in nanocrystalline thin films
M. Bartosik, R. Daniel, Christian Mitterer et al. · Scripta Materialia · 2012 · 119 citations
Natural Sciences, Materials Engineering, Materials Science +14
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)
Praveen Kumar, I. Dutta, Muhannad S. Bakir · Journal of Electronic Materials · 2011 · 100 citations · Full text
Engineering, Materials Engineering, Materials Science +17
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration
J. Van Olmen, Cedric Huyghebaert, Jan Coenen et al. · Microelectronic Engineering · 2010 · 79 citations
Engineering, Materials Engineering, Materials Science +16