S. Carniello

Interface traps density-of-states as a vital component for hot-carrier degradation modeling

Stanislav Tyaginov, Ivan A. Starkov, O. Triebl et al. · Microelectronics Reliability · 2010 · 57 citations

Device Modeling, Engineering, Physics +10

Through Silicon Via Reliability

Cathal Cassidy, Jochen Kraft, S. Carniello et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 57 citations

Reliability, Electrical Engineering, Reliability Engineering +14

Hot-carrier degradation caused interface state profile—Simulation versus experiment

Ivan A. Starkov, Stanislav Tyaginov, H. Enichlmair et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2011 · 31 citations

Electrical Engineering, Hot-carrier Degradation, Engineering +10

Hot-carrier degradation modeling using full-band Monte-Carlo simulations

Stanislav Tyaginov, Ivan A. Starkov, O. Triebl et al. · 2010 · 26 citations

Stress measurements in tungsten coated through silicon vias for 3D integration

C. Krauss, S. Labat, S. Escoubas et al. · Thin Solid Films · 2012 · 22 citations

Materials Science, Stress Measurements, 3D Ic Architecture +9