Muhannad S. Bakir

Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

Bing Dang, Muhannad S. Bakir, Deepak Sekar et al. · IEEE Transactions on Advanced Packaging · 2010 · 127 citations

Engineering, Computer Engineering, Electrical Engineering +17

Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering

Daniel Lorenzini, Craig Green, Thomas E. Sarvey et al. · International Journal of Heat and Mass Transfer · 2016 · 127 citations

Engineering, Mechanical Engineering, Heat Transfer +16

Power Delivery for 3D Chip Stacks: Physical Modeling and Design Implication

Gang Huang, Muhannad S. Bakir, Azad Naeemi et al. · 2007 · 125 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 3D-IC Technology with Integrated Microchannel Cooling

Deepak Sekar, Calvin King, Bing Dang et al. · 2008 · 114 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)

Praveen Kumar, I. Dutta, Muhannad S. Bakir · Journal of Electronic Materials · 2011 · 100 citations · Full text

Engineering, Materials Engineering, Materials Science +17