Calvin King

Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

Bing Dang, Muhannad S. Bakir, Deepak Sekar et al. · IEEE Transactions on Advanced Packaging · 2010 · 126 citations

Engineering, Liquid Metal Cooling, Microfluidic Cooling +20

A 3D-IC Technology with Integrated Microchannel Cooling

Deepak Sekar, Calvin King, Bing Dang et al. · 2008 · 113 citations

Engineering, Liquid Metal Cooling, Integrated Circuits +21

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

Muhannad S. Bakir, Calvin King, Deepak Sekar et al. · 2008 · 100 citations

Engineering, Device Integration, Liquid Metal Cooling +28

3D stacking of chips with electrical and microfluidic I/O interconnects

Calvin King, Deepak Sekar, Muhannad S. Bakir et al. · 2008 · 74 citations

Engineering, Computer Architecture, Integrated Circuits +22

Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology

Yue Zhang, Calvin King, Jesal Zaveri et al. · 2011 · 47 citations

Engineering, Liquid Metal Cooling, Computer Architecture +20