IEEE Electron Device Letters · 2023 · 23 citations · 33 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsIii-v SemiconductorsSemiconductor Device MaterialsSemiconductor HeterostructuresWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBreakdown VoltageGallium Nitride Power DevicesHigh-voltage BreakdownJunction BreakdownMesa FormationSchottky Barrier CharacteristicsSchottky Barrier DiodesVertical Power Devices
This work demonstrates quasi-vertical GaN Schottky barrier diodes (SBDs) on 6-inch Si substrate with a breakdown voltage (BV) over 1 kV, the highest BV reported in vertical GaN-on-Si SBDs to date. The deep mesa inherently in quasi-vertical devices is leveraged to form a self-aligned edge termination, and the mesa sidewall is covered by the p-type nickel oxide (NiO) as a reduced surface field (RESURF) structure. This novel termination enables a parallel-plane junction electric field of 2.8 MV/cm. The device also shows low turn-on voltage of 0.5 V, and low specific on-resistance of 1.1 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text{m}\Omega \cdot $ </tex-math></inline-formula> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . Moreover, the device exhibits excellent overvoltage robustness under the continuous 800 V stress in the unclamped inductive switching test. These results show the good promise of the low-cost vertical GaN-on-Si power diodes.
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GaN-on-Si Power Technology: Devices and Applications
Kevin J. Chen, Oliver D. Häberlen, Alex Lidow et al. · IEEE Transactions on Electron Devices · 2017 · 1.6K citations
GaN-on-Si Vertical Schottky and p-n Diodes
Yuhao Zhang, Min Sun, Daniel Piedra et al. · IEEE Electron Device Letters · 2014 · 182 citations