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Hillock growth in thin films

P. Chaudhari · Journal of Applied Physics · 1974 · 203 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

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Mechanical stress as a function of temperature in aluminum films

Donald S. Gardner, P. A. Flinn · IEEE Transactions on Electron Devices · 1988 · 164 citations

Natural Sciences, Materials Engineering, Materials Science +17