Concepedia

Scott Pollard

SP

18

Publications

437

Citations

15

H-Index

2012

Active since

Affiliations

Corning (United States)(Current)

Binghamton University

University of Central Florida

Scott Pollard is an author at Corning (United States) specializing in electronic packaging, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingApplied PhysicsMechanical Engineering3D PrintingMicroelectronicsMaterials EngineeringMechanics Of MaterialsMicrofabrication

Publications per year

2012–2023

18

Publications

18

Development of substrates for through glass vias (TGV) for 3DS-IC integration

Aric Shorey, Scott Pollard, A. A. Streltsov et al. · 2012 · 42 citations

Engineering, Device Integration, Integrated Circuits +21

Advancements in fabrication of glass interposers

Aric Shorey, Philippe Cochet, Alan Huffman et al. · 2014 · 41 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates

Chukwudi Okoro, Shrisudersan Jayaraman, Scott Pollard · Microelectronics Reliability · 2021 · 34 citations

Materials Engineering, Materials Science, Glass-ceramic +9

The interfacial reliability of through-glass vias for 2.5D integrated circuits

Omar Ahmed, Golareh Jalilvand, Scott Pollard et al. · Microelectronics International · 2020 · 31 citations

Energy Release Rate, Engineering, Mechanical Engineering +19

Fabrication of 3D-IC interposers

John Keech, Satish C. Chaparala, Aric Shorey et al. · 2013 · 30 citations

Engineering, Integrated Circuits, Cost-effective Solutions +18

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