A. A. Streltsov is an author at Corning (United States) specializing in applied physics, 3d printing, and engineering.
Top concepts
3D PrintingEngineering3D IntegrationApplied PhysicsOptoelectronicsMaterial ScienceMicroelectronicsMicrofabricationIntegrated CircuitsElectronic Packaging
Publications per year
2012–2012
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Development of substrates for through glass vias (TGV) for 3DS-IC integration
Aric Shorey, Scott Pollard, A. A. Streltsov et al. · 2012 · 42 citations
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