Concepedia

Alan Huffman

AH

Statistics

Publications

20

Citations

527

H-Index

13

Active since

2001

Affiliations

RTI International(Current)

Research Triangle Park Foundation

MCNC Research and Development Institute

Acumen (United States)

Infrared Laboratories (United States)

Alan Huffman is an author at RTI International specializing in engineering, electrical engineering, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMaterial ScienceApplied PhysicsMicrofabrication3D PrintingMaterials Engineering3D Integration

Publications per year

2001–2016

20

Publications

20

The linguistics of William Diver and the Columbia school

Alan Huffman · WORD · 2001 · 130 citations · Full text

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

Alan Huffman, John Lannon, Matthew Lueck et al. · Journal of Instrumentation · 2009 · 44 citations

Electrical Resistance, Engineering, Device Integration +19

Advancements in fabrication of glass interposers

Aric Shorey, Philippe Cochet, Alan Huffman et al. · 2014 · 41 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Through glass vias (TGV) and aspects of reliability

Matthew Lueck, Alan Huffman, Aric Shorey · 2015 · 32 citations

Engineering, Chemical Composition, Mechanical Engineering +22

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

Matthew Lueck, Jason D. Reed, Christopher W. Gregory et al. · IEEE Transactions on Electron Devices · 2012 · 32 citations

Engineering, Area Arrays, Integrated Circuits +18

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